Samsung starts mass production of 3d flash chip type approval. 3d refers to multi-layer circuits are stacked, or “stacked” on each other. It is according to Samsung means better scalability for flash chips, then it will be faster to offer increased storage density. Incidentally Taken says that there are already opportunities to stack 24 layers on each other in a chip.
Class=”paragraphIntro”> The first chip with the new technology has a capacity of 16 GB.
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